Description:
The RF Technology Division is seeking an employee to develop and improve wafer fabrication and packaging processes for superconductive quantum and classical circuits; design experiments and testing methods; perform cryogenic characterization; mentor staff; document and communicate research; and collaborate with partners to advance mission-critical quantum R&D.Requirements:
All applicants must submit a resume NOT TO EXCEED two pages on standard-size pape r. If the resume exceeds two pages, only the first two pages will be reviewed for qualifications or assessment determinations.
BASIC REQUIREMENTS:
A. Degree: physical sciences, life sciences, or engineering that included 30 semester hours in chemistry, supplemented by course work in mathematics through differential and integral calculus, and at least 6 semester hours of physics.
OR
B. Combination of education and experience -- course work equivalent to a major as shown in A above, including at least 30 semester hours in chemistry, supplemented by mathematics through differential and integral calculus, and at least 6 semester hours of physics, plus appropriate experience or additional education.
AND
In addition to the specialized experience listed above, applicants must possess one year (52 weeks) of specialized experience equivalent to at least the GS-12 level, (ZP-III at NIST).
Specialized experience is defined as:
- Hands-on microfabrication expertise in materials chemistry, thin-film chemical and physical deposition and etching processes, surface and interface chemistry, and chemical and physical characterization of electronic devices on silicon wafers.
- Hands-on experience with fabrication and process development of integrated circuits/superconductive circuits in ISO Class 5 (or lower Class #) cleanroom.
- Experimental laboratory experience with cryogenic electrical testing to millikelvin temperatures.
- Experimental laboratory experience with elemental/chemical/physical analysis of thin films, including AFM, SEM, and FIB-SEM tools.
- Experience with computer programming for data acquisition and analysis.
- Experimental laboratory experience with flip-chip electronics packaging and cryogenic reliability testing.
Experience refers to paid and unpaid experience, including volunteer work done through National Service programs (e.g., Peace Corps, AmeriCorps) and other organizations (e.g., professional; philanthropic; religious; spiritual; community, student, social). Volunteer work helps build critical competencies, knowledge, and skills and can provide valuable training and experience that translates directly to paid employment. You will receive credit for all qualifying experience, including volunteer experience.
The qualification requirements in this vacancy announcement are based on the U.S. Office of Personnel Management (OPM) Qualification Standards Handbook .
If requesting reconsideration of your qualification determination, please refer to the following site: Applicant Reconsideration